Course Information for 6421 - Fundamentals of Micromachining
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Primary Instructor: Florian Solzbacher
Credits: 3.0
Semesters Offered:Spring
Frequency Offered:Annual
Cross Listings:MEE 5050, ECE 5221 Meets with ME EN 6050, ECE 6221, BIOEN 6421, MSE 6421.
Prerequisites:Graduate standing in engineering or instructor's consent
Catalog Description: Introduction to the principles of micromachining technologies. Topics include cleanroom technology, materials, substrate and wafer fabrication (from sand to poly crystalline Si to wafer, CZ, FZ, NTD), introduction to vacuum technology, oxidation and oxidation kinetics, layer modification (doping, ion implantation, diffusion, barriers, SIMOX, etc.) , CVD, PVD, Electroplating, Lithography, layer patterning (dry and wet etching), bulk and surface micromachining, wafer bonding (anodic, fusion, eutectic), alternative processes (LIGA, FOTURAN, etc.), packaging (wire bonding, lead frames, flip-chip, MCM, packages), economical considerations (project planning, cost planning and budgeting, production cost and projections) The course also includes a lab that all students sign up for in class.
Required Texts:Introduction to Microfabrication, by Mark Madou, CRC Press.
Course Website:
Course Syllabus:Syllabus_6421.pdf